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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械知方楼@5126
联系方式：dongzg@dlut.edu.cn
电子邮箱：dongzg@dlut.edu.cn
扫描关注
- [61]Zhou, Ping, Dong, Zhigang, Kang, Renke, Jin, Zhuji, Guo, Dongming, P (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing wi...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2015,77(1-4):107-116
- [62]马付建, 康仁科, 董志刚, 刘宇, 沙智华, 张生芳.带中心孔的复合超声变幅杆设计及性能分析[J],机械设计,2015,32(6):51-55
- [63]高尚, 董志刚, 康仁科, 张璧, 郭东明.Warping of silicon wafers subjected to back-thinning process[J],Precision Engineering,2015,40(-):87-93
- [64]Liu, Shutian, Hu, Rui, Li, Quhao, Zhou, Ping, Dong, Zhigang, Kang, Renke, ST (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China..Topology optimization-based lightweight primary mirror design of a large-aperture space telesco...[J],APPLIED OPTICS,2014,53(35):8318-8325
- [65]董志刚, 康仁科, 郭东明, 高尚.Investigation on properties of magnesia grinding wheels used in silicon wafer grinding[A],2014,117(-):273-278
- [66]朱祥龙, 董志刚, 康仁科, 郭东明.Design of Double-Sided Polishing Machine for Functional Crystal Substrate. The International Symp...[A],2014,1017:580-585
- [67]刘书田, 胡瑞, 周平, 康仁科, 董志刚, Liu, S.-T.(stliu@dlut.edu.cn).基于筋板式基结构的大口径空间反射镜构型设计的拓扑优化方法[J],光学精密工程,2013,21(7):1803-1810
- [68]Gao, Shang, Guo, Dongming, Kang, Renke, Dong, Zhigang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, 2 Linggong Rd, Dalian 116023, Peoples R China..Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2013,227(B4):578-586
- [69]高尚, 康仁科, 董志刚, 郭东明, Kang, R.(kangrk@dlut.edu.cn).工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2013,49(3):88-94
- [70]董志刚, 朱祥龙, 康仁科.Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding ...[A],2013,797:597-602
- [71]马付建, 朱祥龙, 康仁科, 董志刚, 邹双庆.Study on the Subsurface Damages of Glass Fiber Reinforced Composites[A],2013,797:691-695
- [72]Gao, Shang, Kang, Renke, Dong, Zhigang, Zhang, B., S (reprint author), Dalian Univ Technol, Inst Adv Mfg Technol, Sch Mech Engn, Minist Educ, Key Lab Precis & Nontradit Machining Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2013,64:31-37
- [73]康仁科, 马付建, 董志刚, 郭东明.难加工材料超声辅助切削加工技术[J],航空制造技术,2012,16:44-49
- [74]朱祥龙, 董志刚, 康仁科, 郭东明.Development of ultra-precision grinder for 300mm wafers[A],2012,565:609-614
- [75]董志刚, 康仁科.Experimental investigation on ultrasonic assisted grinding of high volume fraction sic particles ...[A],2012,565:142-147
- [76]董志刚, 周平, 康仁科, 郭东明.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[A],2012,565:105-110
- [77]Zhu X., Kang R., Dong Z., Feng G., Kang, R., Key Laboratory for Precision, Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: kangrk@dlut.edu.cn.Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder[J],Journal of Semiconductors,2011,32(10)
- [78]董志刚.Precision honing of stainless steel valve core[A],2011,487:438-442
- [79]康仁科, 金洙吉, 董志刚.Research on the Polishing Performance of CMP Slurry for the Sapphire Crystal[A],2011,325:457-463
- [80]朱祥龙, 康仁科, 董志刚, 郭东明, Zhu, X., Key Laboratory for Precision, Non-traditional Machining Technology, Dalian University of Technology, Dalian, Liaoning, 116024, China.晶硅片超精密磨削技术与设备[J],中国机械工程,2010,21(18):2156-2164