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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
电子邮箱：guodm@dlut.edu.cn
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- [461]康仁科, 金洙吉, 郭东明.Theoretical analysis and experimental verification of triangular fracture defects of MgO single c...[J],Key Engineering Materials,2008,364(366):739-744
- [462]余祖元, 郭东明.Applications of Micro EDM[A],2008
- [463]Gao, H., Liu, X. S., Li, Q., Guo, D. M..Product numbering system design for single piece or small batch customization manufacture and i...[A],2008,10-12:23-+
- [464]Guo, D. M., Zhang, M., Jin, Z. J., Zuo, B. X., DM (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116023, Peoples R China..Particle strengthening of the surface of copper electrode for electrical discharge machining[J],INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY,2008,31(1):81-87
- [465]郭晓光, 郭东明, 康仁科, 金洙, Guo, X..单晶硅纳米级磨削过程的理论研究[J],中国机械工程,2008,19(23):2847-2851
- [466]Liu, X.S., Guo, D.M., Gao, H..The study on data exchange of huge 3D model[A],2008,10-12:150-154
- [467]Ji, Tian, Guo, Dongming, Bian, Guihong.Removal process technology of precision grinding for complicated surface part of high performan...[A],2008,359-360:123-+
- [468]Sui, Jianxiu, Zhang, Xueliang, Chen, Xiqu, Du, Jiaxi, Guo, Dongming.Study on contact mechanism of interface in wafer CMP based on abrasion behavior[A],2008,359-360:254-+
- [469]Liu, X. S., Gao, H., Guo, D. M..The study on data exchange of huge 3D model[A],2008,10-12:150-154
- [470]Wang, Ke, Kang, Renke, Jin, Zhuji, Guo, Dongming.Theoretical analysis and experimental verification of triangular fracture defects of MgO single c...[A],2008,364-366 II:739-744
- [471]Sun, Yuhui, Kang, Renke, Guo, Dongming.A method to improve uniformity of material removal of chemical mechanical polishing in LCOS proce...[A],2008,364-366 II:686-689
- [472]Su, J. X., Chen, X. Q., Du, Guo, D. M., Kang, R. K..Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement ...[A],2008,53-54:119-+
- [473]Guo, D. M., Qin, N., Kang, R. K., Jin, Z. J..Novel Measurement Technique on 3D Surface Topography of Polishing Pad[A],2008,53-54:265-271
- [474]Qiao, Y. P., Guo, D. M., Jin, Z. J., Kang, R. K..The Characteristics of Surface Residual Stresses by Plane Grinding Invar and the Effects of The...[A],2008,53-54:293-298
- [475]季田, 卞桂虹, 刘向东, 郭东明.离心压缩机窄流道闭式叶轮抛光工艺研究[J],金刚石与磨料磨具工程,2007,6:38-41,50
- [476]贾振元, 刘巍, 张永顺, 王福吉, 郭东明, Jia, Z.(jzyxy@dlut.edu.cn).超磁致伸缩薄膜悬臂梁的非线性变形分析及试验[J],机械工程学报,2007,43(12):5-11
- [477]郭晓光, 郭东明, 康仁科, 金洙吉, Guo, X.-G..基于深腾1800机群系统的分子动力学并行仿真研究[J],大连理工大学学报,2007,47(6):818-822
- [478]吴东江, 马广义, 曹先锁, 王续跃, 赵福令, 郭东明, Wu, D.-J.(djwudut@dlut.edu.cn).脉冲激光弯曲成形技术中硅片表面的形貌分析[J],中国激光,2007,34(11):1589-1593
- [479]苏建修, 傅宇, 杜家熙, 陈锡渠, 张学良, 郭东明.抛光垫表面特性分析[J],半导体技术,2007,32(11):957-960
- [480]霍凤伟, 郭东明, 金洙吉, 康仁科, 赵福令, Huo, F.(huofengwei@sohu.com).细粒度金刚石砂轮形貌测量与评价[J],机械工程学报,2007,43(10):108-113