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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
电子邮箱：guodm@dlut.edu.cn
扫描关注
- [481]Guo, Dongming, Zhang, Min, Jin, Zhuji, Kang, Renke, M (reprint author), Dalian Univ Technol, Key Lab Minist Educ China Precis & Non Tradit Mac, Dalian 116024, Peoples R China..Effect of direct current and pulse plating on the EDM performance of copper-zirconium diboride ...[J],JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING,2007,14(5):464-468
- [482]郭晓光, 郭东明, 康仁科, 金洙吉, Guo, X.(guoxg@dl.cn).原子量级条件下单晶硅磨削过程中的亚表面损伤[J],半导体学报,2007,28(9):1353-1358
- [483]王续跃, 许卫星, 司马媛, 吴东江, 康仁科, 郭东明, Wang, X.-Y.(wbzzd@dlut.edu.cn).利用图像处理技术评价硅片表面清洗率[J],光学精密工程,2007,15(8):1263-1268
- [484]Guo, Dongming, Liu, Jingyuan, Kang, Renke, Jin, Zhuji, DM (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116023, Peoples R China..A pad roughness model for the analysis of lubrication in the chemical mechanical polishing of a...[J],SEMICONDUCTOR SCIENCE AND TECHNOLOGY,2007,22(7):793-797
- [485]霍凤伟, 金洙吉, 康仁科, 郭东明, 杨春, Huo, F.-W.(huofengwei@sohu.com).细粒度金刚石砂轮表面磨粒识别研究[J],大连理工大学学报,2007,47(3):358-362
- [486]李庆忠, 郭东明, 康仁科.ULSI制造中铜CMP抛光液的技术分析[J],半导体技术,2007,32(5):382-386
- [487]余祖元, 郭东明, 贾振元.微细电火花加工技术[J],中国科技论文在线,2007,2(3):214-220
- [488]李庆忠, 金洙吉, 张然, 康仁科, 郭东明.分散剂对铜CMP材料去除率和表面粗糙度影响的实验研究[J],润滑与密封,2007,32(3):70-72,109
- [489]Zhang Yinxia, Kang Renke, Guo Dongming, Jin Zhuji, Zhang, YX (reprint author), Dalian Univ Technol, Key Lab Precis & Non Tradit Maching Technol, Chinese Minist Educ, Dalian 116024, Peoples R China..Microstructure studies of the grinding damage in monocrystalline silicon wafers[J],RARE METALS,2007,26(1):13-18
- [490]刘巍, 张永顺, 贾振元, 王福吉, 郭东明, Liu, W..GMF双层膜几何非线性变形模型及实验研究[J],大连理工大学学报,2007,47(1):34-38
- [491]Guo, D., Liu, M., Sheng, X., Sun, Y., Zhang, C..Determination of the scheme of the precision grinding compensation on the radome[J],Frontiers of Mechanical Engineering in China,2007,2(3):263-266
- [492]Huo, F.W., Jin, Z.J., Zhao, F.L., Kang, R.K., Guo, D.M., F.W.(huofengwei@sohu.com).Experimental investigation of brittle to ductile transition of single crystal silicon by single g...[J],Key Engineering Materials,2007,329:433-438
- [493]Guo, D.M., Zhang, C.B., Kang, R.K., Sun, Y.W., D.M.(guodm@dlut.edu.cn).Inverse method for determining grinding area and material removal amount in grinding radome[J],Key Engineering Materials,2007,329:81-86
- [494]Huo, F. W., Jin, Z. J., Kang, R. K., Guo, D. M..A method for grinding mode identification in grinding of silicon wafers[A],2007,24-25:255-260
- [495]Sun, Yu-Wen, Guo, Dong-Ming, Jia, Zhen-Yuan, YW (reprint author), Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China..Spiral cutting operation strategy for machining of sculptured surfaces by conformal map approac...[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2006,180(1-3):74-82
- [496]徐道明, 贾振元, 郭东明, Xu, D.-M..理想材料零件实体模型自动添加支撑技术研究[J],大连理工大学学报,2006,46(6):837-844
- [497]霍凤伟, 康仁科, 赵福令, 金洙吉, 郭东明.硅片纳米磨削过程中磨粒切削深度的测量[J],金刚石与磨料磨具工程,2006,5:69-73
- [498]Sun, Yuhui, Kang, Renke, Guo, Dongming.Modeling of back pressure distribution on the wafer loaded in a multi-zone carrier in chemical ...[A],2006,532-533:233-+
- [499]Ren, Li, Guo, Dongming, Yang, Rui, Jia, Zhenyuan.Optimization design of heterogeneous mold based on genetic algorithm[A],2006,532-533:825-+
- [500]Guo, Dongming, Zhang, Min, Jin, Zhuji, Kang, Renke, M (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining, Dalian 116023, Peoples R China..Effects of chloride ion on the texture of copper and Cu-ZrB2 coatings electrodeposited from cop...[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2006,22(5):643-646