|
个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：知方楼5130
联系方式：15998535043
电子邮箱：zhuxianglong@dlut.edu.cn
扫描关注
- [41]Yao, Weihua, 康仁科, 郭晓光, 朱祥龙.Effect of grinding residual height on the surface shape of ground wafer[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2022,299
- [42]莫宇博, 朱祥龙, 董志刚, 康仁科, 戴恒震, 李琦岩.Error analysis and Device Improvement for Measuring Straightness of Deep Hole Based on Photoelect...[A],The 22nd International Symposium on Advances in Abrasive Technology,2022,1-7
- [43]董志刚, 朱祥龙, 康仁科.Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding ...[A],Advanced materials research,2022,797:597-602
- [44]董志刚, Zhao, X.W., 朱祥龙, 康仁科, Hao, B.J..Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding ...[J],Advanced materials research,2022,797:597-602
- [45]朱祥龙, 于力, 董志刚, 康仁科, 高尚, Li, Liansheng.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206
- [46]Liu, Zhiqiang, 康仁科, Haijun, 董志刚, 鲍岩, 高尚, 朱祥龙.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and br...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
- [47]郭江, 朱祥龙, 董志刚, 郭晓光, 康仁科, 郭东明.Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishin...[A],6th International Conference on Nanomanufacturing,2022
- [48]Fan, Kangnan, 金洙吉, 朱祥龙.Investigation on electrochemical grinding (ECG) of pure iron material[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022
- [49]Mu, Qing, 金洙吉, 康仁科, 朱祥龙, Han, Xiaolong, Zhang, Zili.Investigation on surface/subsurface damage mechanism in yttrium aluminum garnet crystal lapping a...[A],19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019,2022,440-441
- [50]Liu, Haijun, 朱祥龙, 康仁科, 董志刚, Chen, Xiuyi.Three-point-support method based on position determination of supports and wafers to eliminate ...[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,46:339-348
- [51]郭江, 朱祥龙, 董志刚, 郭晓光, 康仁科, 郭东明.6th International Conference on Nanomanufacturing[A],Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishing (VAMAP) method,2022
- [52]Fan, Kangnan, 金洙吉, 朱祥龙, Wang, Qiulin, 孙晶.A facile electrochemical machining process to fabricate superhydrophobic surface on iron materi...[J],JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY,2022,42(3):457-464
- [53]郑非非, 董志刚, 康仁科, 张璧, 朱祥龙, Liu, Jinting.Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from ener...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,98(9-12):2257-2270
- [54]朱祥龙, Chen, Xiuyi, Liu, Haijun, 康仁科, 张璧, 董志刚.An empirical equation for prediction of silicon wafer deformation[J],Materials Research Express,2022,4(6)
- [55]张玉, 康仁科, 高尚, Huang, Jinxing, 朱祥龙.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grin...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
- [56]朱祥龙, Jiao Z.H., 康仁科, 王振贵, 徐红.A novel method for grinding wheel setting based on acoustic emissions[A],19th International Symposium on Advances in Abrasive Technology, ISAAT 2016,2022,874:79-84
- [57]Zhang, Zili, 金洙吉, 郭江, Han, Xiaolong, Mu, Qing, 朱祥龙.A novel chemical mechanical polishing slurry for yttrium aluminum garnet crystal[J],APPLIED SURFACE SCIENCE,2022,496
- [58]张军, 刘兵, 钱敏, 朱祥龙, Kang, R..A novel piezoelectric grinding dynamometer for monitoring ultra-precision grinding of silicon waf...[J],Advanced materials research,2022,126-128:707-712
- [59]秦炎, 康仁科, 董志刚, 王毅丹, 杨洁, 朱祥龙.Burr removal from measurement data of honeycomb core surface based on dimensionality reduction an...[J],MEASUREMENT SCIENCE TECHNOLOGY,2022,29(11):115010-115010
- [60]董志刚, 朱祥龙, 康仁科, 张璧.Characterisation of material removal in ultrasonically assisted grinding of SiCp/Al with high vol...[J],The International Journal of Advanced Manufacturing Technology,2022,93:2827-2839