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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
联系方式：15641188312
电子邮箱：htma@dlut.edu.cn
扫描关注
- [21]周长海, Li, XW, Wang, SH, 马海涛.Magnetic effect on oxide-scale growth of Fe-5Cr alloy[A],2018,292(UNSP 012090)
- [22]Kunwar Anil, Raback Peter, 尚胜艳, MAlla Prafulla, 宋学官, 王云鹏, 马海涛.A Computational Model for Simulation of Temperature during Radio-Frequency Ablation of Biological...[A],2018 IEEE International Conference on Computational Electromagnetics,2018,8496461-8496461
- [23]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
- [24]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Wang, Yunpeng, Chen, Jun, Huang, Mingliang, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
- [25]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
- [26]A. Kunwar, 马浩然, 马海涛, J.H. Sun, 赵宁, 黄明亮.Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid...[J],Materials Letter,2018,230:76-76
- [27]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
- [28]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng.Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Ag...[A],2018,1744-1747
- [29]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Song, Xueguan, Malla, Prafulla Bahadur, Wang, Yunpeng, Ma, Haitao.A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes[A],2018,1329-1332
- [30]Guo, Bingfeng, Huang, Ru, Yao, Jinye, Qi, Xiao, Kunwar, Anil, Wang, Yunpeng, Ma, Haitao.Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni so...[A],2018,445-449
- [31]Ma, Haoran, Yao, Jinye, Wang, Chen, Shang, Shengyan, Yunpeng, Haitao.Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple ref...[A],2018,441-444
- [32]Ji, Shengnan, Wang, Chen, Yunpeng, Ma, Haitao, Zhao, Ning.Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective bac...[A],2018,396-399
- [33]Qi, Xiao, Ma, Haoran, Huang, Ru, Yao, Jinye, Shang, Shengyan, Anil, Wang, Yunpeng, Haitao.Study on Electrochemical Migration of Sn-0.7Cu[A],2018,387-390
- [34]Huang, Ru, Xia, Mengrou, Yao, Jinye, Wang, Boyin, Qi, Xiao, Qiao, Junshan, Ma, Haitao.Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow[A],2018,391-395
- [35]Yao, Jinye, Li, Hua, Huang, Ru, Qi, Xiao, Wang, Boyin, Qiao, Junshan, Yunpeng, Ma, Haitao.Mechanism of Cu5Zn8 layer act as a diffusion barrier layer[A],2018,383-386
- [36]Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Yao, Jinye, Ma, Haitao, Yunpeng.Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints[A],2018,135-140
- [37]Zhong, Y., Ma, H. T., Wang, Y. P., Qiao, Y. Y., Dong, W., Liu, C. Y., Zhao, N., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
- [38]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
- [39]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
- [40]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Ma, Haitao, Wang, Yunpeng, Wong, Ching-ping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2017,32(18):3555-3563