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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
联系方式：15641188312
电子邮箱：htma@dlut.edu.cn
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- [41]Ma, H.R., Wang, Y.P., Chen, J., H.T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multip...[A],2017,1402-1405
- [42]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, Chingping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
- [43]Yao, Mingjun, Fan, Jun, Zhao, Ning, Xiao, Zhiyi, Yu, Daquan, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhe...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):9091-9095
- [44]Zhao, N., Yao, M. J., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluor...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):8824-8831
- [45]Zhao, N., Deng, J. F., Zhong, Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Unde...[J],JOURNAL OF ELECTRONIC MATERIALS,2017,46(4):1931-1936
- [46]Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder jo...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406
- [47]Yao, Mingjun, Zhao, Ning, Fan, Jun, Xiao, Zhiyi, Ma, Haitao, Yu, Daquan.DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR B...[A],2017
- [48]Zhao, N., Zhong, Y., Dong, W., Huang, M. L., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Wong, CP (reprint author), Georgia Inst Technol, Atlanta, GA 30332 USA..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
- [49]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., N, Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
- [50]Kunwar, Anil, Tonks, Michael R., Shang, Shengyan, Song, Xueguan, Wang, Yunpeng, Ma, Haitao.Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn...[A],2017,1502-1507
- [51]赵宁, 董伟, 黄明亮, 马海涛.Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interc...[J],Applied Physics Letters,2017,110(9):93504-
- [52]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., Wong, C. P..Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applicat...[A],2017,0:411-416
- [53]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Wang, Yunpeng, Ma, Haitao, Chen, Jun.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
- [54]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
- [55]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Wang, Yunpeng, Wong, Ching-Ping.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
- [56]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
- [57]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng, Wong, Ching-Ping.Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient[A],2017,1478-1482
- [58]Shang, Shengyan, Kunwar, Anil, Wu, Yingchao, Ma, Haitao.Effects of Cu Nanoparticles Doped Flux on the Microstructure of IMCs between Sn Solder and Cu S...[A],2017,1577-1581
- [59]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects...[J],INTERMETALLICS,2016,79:28-34
- [60]Ma, Haoran, Kunwar, Anil, Guo, Bingfeng, Sun, Junhao, Jiang, Chengrong, Wang, Yunpeng, Song, Xueguan, Zhao, Ning, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder ...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12)