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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
联系方式：15641188312
电子邮箱：htma@dlut.edu.cn
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- [61]张广玉, 许军, 马海涛, 程从前, 王富岗, 赵杰.在役十万小时一段炉转化管的寿命评估[J],大氮肥,2016,39(5):296-300
- [62]Zhao, N., Zhong, Y., Huang, M. L., Dong, W., Ma, H. T., Wang, Y. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
- [63]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under t...[A],2016,264-267
- [64]Kunwar, Anil, Ma, Haoran, Qi, Meng, Sun, Junhao, Qu, Lin, Guo, Bingfeng, Zhao, Ning, Wang, Yunpeng, Haitao.Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu J...[A],2016,608-611
- [65]Jiang, Chengrong, Guo, Bingfeng, Ma, Haoran, Kunwar, Anil, Meng, Zhixian, Haitao.The Study of the Growth Behavior of Cu6Sn5 at the Sn/Cu Interface during the Heating Preservati...[A],2016,327-330
- [66]Kunwar, Anil, Givernaud, Julien, Ma, Haoran, Wang, Yunpeng, Haitao, Meng, Zhixian, Shang, Shengyan.Modelling the Melting of Sn0.7Cu Solder Using the Enthalpy Method[A],2016,166-169
- [67]Zhao, Ning, Ma, Haitao, Huang, Mingliang, Zhong, Yi, Deng, Jianfeng.Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,273-276
- [68]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Ma, Haitao.In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu solderi...[A],2016,395-399
- [69]Ma, Haoran, Kunwar, Anil, Meng, Zhixian, Guo, Bingfeng, Zhao, Ning, Haitao.The morphology variation of IMC on the solder/bubble interface under different cooling rates an...[A],2016,425-428
- [70]Kunwar, Anil, Ma, Haoran, Haitao, Guo, Bingfeng, Meng, Zhixian, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromi...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(7):7699-7706
- [71]Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2016,172:211-215
- [72]Zhou, C. H., Liu, A. L., Ma, H. T., Wang, L., CH (reprint author), Heilongjiang Univ Sci & Technol, Sch Mat Sci & Engn, Harbin 150022, Peoples R China..The Oxide-Scale Growth and Failure on an Fe-16Cr Alloy in the Presence of Compressive Stress[J],OXIDATION OF METALS,2016,85(5-6):537-546
- [73]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
- [74]Zhong, Yi, Huang, Mingliang, Deng, Jianfeng, Ma, Haitao, Dong, Wei, Zhao, Ning.STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION[A],2016
- [75]王云鹏, 宋学官, 赵宁, 马海涛.Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12):1052-1052
- [76]马海涛, 赵宁, 黄明亮.On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solde...[J],Materials Letters,2016,172(1):211-215
- [77]赵宁, 黄明亮, 马海涛.Interfacial reactions of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,1(1):273-276
- [78]马海涛, 王云鹏, 赵宁, 黄明亮.Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder join...[J],Journal of Material Science: Materials in Electronics,2016,28(1):5398-5406
- [79]Wan, B. Q., Sun, X. Y., Ma, H. T., Feng, R. F., Li, Y. S., Yang, Q., Q (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Plasma enhanced chemical vapor deposition of diamond coatings on Cu-W and Cu-WC composites[J],SURFACE & COATINGS TECHNOLOGY,2015,284:133-138
- [80]Ma, Haitao, Kunwar, Anil, Sun, Junhao, Guo, Bingfeng, Haoran, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the increase of intermetallic compound thickness at anode of molten tin due to...[J],SCRIPTA MATERIALIA,2015,107:88-91