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Hybrid Simulation of Duty Cycle Influences on Pulse Modulated RF SiH4/Ar Discharge

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Date of Publication:2022-10-03

Journal:Plasma Science and Technology

Volume:18

Issue:4

Page Number:394-399

ISSN No.:1009-0630

Pre One:Gas ratio effects on the Si etch rate and profile uniformity in an inductively coupled Ar/CF4 plasma

Next One:Hysteresis induced by gap length effects in capacitively coupled plasmas at low pressures
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