Current position: Home >> Scientific Research >> Research Projects

超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究

Hits:

Leading Scientist:Shang GAO

Supported by:国务院其他部门

Sub-Class of Project:特别资助项目

Status:结题

Supported by:中国博士后科学基金会

Nature of Project:纵向

Project Approval Number:2016T90219

Date of Project Approval:2016-06-13

Scheduled completion time:2017-06-13

Date of Project Initiation:2016-06-13

Date of Project Completion:2017-07-06

Pre One:氧化镓晶体磨削表面损伤形成机理及损伤深度和加工效率协调控制方法

Next One:低损伤超精密磨削硬脆晶体的摩擦化学反应机理研究