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Indexed by:期刊论文

Date of Publication:2017-03-01

Journal:FRONTIERS OF MECHANICAL ENGINEERING

Included Journals:SCIE

Volume:12

Issue:1,SI

Page Number:18-32

ISSN No.:2095-0233

Key Words:micro machining; cutting; electro discharge machining (EDM); laser machining; focused ion beam (FIB)

Abstract:Device miniaturization is an emerging advanced technology in the 21st century. The miniaturization of devices in different fields requires production of micro- and nano-scale components. The features of these components range from the sub-micron to a few hundred microns with high tolerance to many engineering materials. These fields mainly include optics, electronics, medicine, bio-technology, communications, and avionics. This paper reviewed the recent advances in micro- and nano-machining technologies, including micro-cutting, micro-electrical-discharge machining, laser micro-machining, and focused ion beam machining. The four machining technologies were also compared in terms of machining efficiency, workpiece materials being machined, minimum feature size, maximum aspect ratio, and surface finish.