Hits:
Date of Publication:2022-10-02
Journal:INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE
Affiliation of Author(s):机械工程学院
Volume:64
Page Number:31-37
ISSN No.:0890-6955
Pre One:Grinding Marks in Back Grinding of Wafer with Outer Rim
Next One:Effects of taping on grinding quality of silicon wafers in backgrinding