Effects of taping on grinding quality of silicon wafers in backgrinding
Release Time:2022-10-04 Hits:
Date of Publication: 2022-10-02
Journal: FRONTIERS OF MECHANICAL ENGINEERING
Institution: 机械工程学院
Volume: 16
Issue: 3
Page Number: 559-569
ISSN: 2095-0233
Key Words: "taping; silicon wafer; backgrinding; subsurface damage; surface roughness"