Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel
Release Time:2022-10-09 Hits:
Date of Publication: 2022-10-09
Journal: INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Institution: 机械工程学院
Volume: 83
Issue: 5-8
Page Number: 1231-1239
ISSN: 0268-3768