Environment-friendly chemical mechanical polishing using NaHCO3-activated H2O2 slurry for highly efficient finishing of 4H-SiC (0001) surface
Release Time:2024-04-28 Hits:
Indexed by: Journal Papers
Document Code: 385466
Date of Publication: 2024-01-17
Journal: JOURNAL OF MANUFACTURING PROCESSES
Volume: 109
Page Number: 213-221
ISSN: 1526-6125
Key Words: CMP; SILICA; WASTE-WATER TREATMENT; XPS