Current position: Home >> Scientific Research >> Paper Publications

Insights into Interfacial Mechanism of CeO(2)/Silicon and Atomic-Scale Removal Process during Chemo-Mechanical Grinding of Silicon.

Release Time:2024-05-24  Hits:

Journal: Langmuir : the ACS journal of surfaces and colloids

ISSN: 0743-7463

Prev One:A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Next One:Effect of Wheel Path in Raster Grinding on Surface Accuracy of an Off-Axis Parabolic Mirror
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep