Insights into Interfacial Mechanism of CeO2/Silicon and Atomic-Scale Removal Process during Chemo-Mechanical Grinding of Silicon
Release Time:2024-05-24 Hits:
Indexed by: Journal Papers
Document Code: 383553
Date of Publication: 2023-11-07
Journal: LANGMUIR
Volume: 39
Issue: 46
Page Number: 16606-16617
ISSN: 0743-7463
Key Words: CEO2; OXIDE; SI; SIMULATION; SUBSTRATE; SUBSURFACE DAMAGE; SURFACE; WAFERS; WHEELS