location: Current position: Home >> Scientific Research >> Paper Publications

A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Hits:

Journal:JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME

Volume:145

Issue:7

ISSN No.:1087-1357

Key Words:ALGORITHMS; FILMS; FRICTION; MOLECULAR-DYNAMICS; PLANARIZATION; POLISHING TECHNIQUE; REACTIVE FORCE-FIELD; SINGLE-CRYSTAL DIAMOND; SURFACE; WEAR

Pre One:Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Next One:Insights into Interfacial Mechanism of CeO(2)/Silicon and Atomic-Scale Removal Process during Chemo-Mechanical Grinding of Silicon.