location: Current position: Home >> Scientific Research >> Paper Publications

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Hits:

Date of Publication:2024-05-29

Journal:Journal of Physics: Conference Series

Volume:2566

Issue:1

ISSN No.:1742-6588

Pre One:Atomic understanding of elastic-plastic deformation and crack evolution for single crystal AlN during nanoscratch

Next One:A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond