Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel
Release Time:2024-06-04 Hits:
Indexed by: Journal Papers
Document Code: 393250
Date of Publication: 2024-06-10
Journal: PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume: 88
Page Number: 884-894
ISSN: 0141-6359
Key Words: CHIP-THICKNESS MODEL; DEFORMATION; DEPTH; MICRO-CONTACT; PARTICLE; PERFORMANCE; PREDICTION; ROUGHNESS; SURFACE