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Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel

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Date of Publication:2024-06-04

Journal:Precision Engineering

Volume:88

Page Number:884-894

ISSN No.:0141-6359

Key Words:Abrasives; Chemical mechanical polishing; Cost reduction; Grinding performance; Grinding wheels; Low damages; Material removal rate; Non-woven; Polishing wheels; Silicon wafers; Sub-surface damage; Surface integrity; Surface roughness; Ultrafine; Ultrafine abrasive; Ultra-fines; Zirconia

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