Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel
Release Time:2024-06-04 Hits:
Date of Publication: 2024-06-04
Journal: Precision Engineering
Volume: 88
Page Number: 884-894
ISSN: 0141-6359
Key Words: Abrasives; Chemical mechanical polishing; Cost reduction; Grinding performance; Grinding wheels; Low damages; Material removal rate; Non-woven; Polishing wheels; Silicon wafers; Sub-surface damage; Surface integrity; Surface roughness; Ultrafine; Ultrafine abrasive; Ultra-fines; Zirconia