Surface characteristics and material removal mechanisms during nanogrinding on C-face and Si-face of 4H-SiC crystals: Experimental and molecular dynamics insights
Release Time:2024-06-02 Hits:
Date of Publication: 2024-06-01
Journal: Applied Surface Science
Volume: 665
ISSN: 0169-4332
Key Words: 4h-SiC; C-face; Cost effective; Cost effectiveness; Ductile fracture; Fracture toughness; Grinding (machining); Material removal mechanisms; Molecular dynamics; Morphology; Nano-grinding; Power devices; Radio frequency devices; Si faces; Silicon wafers; Single crystals; Surface characteristics; Surface materials; Surface morphology; Surface roughness