Current position: Home >> Scientific Research >> Paper Publications

A new polishing method for complex structural parts: Moist particle electrolyte electrochemical mechanical polishing (MPE-ECMP)

Release Time:2024-06-16  Hits:

Date of Publication: 2024-06-15

Journal: Electrochemistry Communications

Volume: 150

ISSN: 1388-2481

Prev One:Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal

Next One:Atomic Understanding of the Plastic Deformation Mechanism of 4H-SiC Under Different Grain Depth-of-cut During Nano-Grinding