Effect of micromorphology on measurement of residual stress of ground silicon wafers using Raman spectroscopy
Release Time:2024-09-05 Hits:
Indexed by: Journal Papers
Document Code: 395275
Date of Publication: 2024-08-10
Journal: JOURNAL OF THE BRAZILIAN SOCIETY OF MECHANICAL SCIENCES AND ENGINEERING
Volume: 46
Issue: 8
ISSN: 1678-5878
Key Words: DAMAGE