Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering
Release Time:2024-09-05 Hits:
Indexed by: Journal Papers
Document Code: 396126
Date of Publication: 2024-10-18
Journal: JOURNAL OF ELECTRONIC MATERIALS
Volume: 53
Issue: si
Page Number: 6432-6447
ISSN: 0361-5235
Key Words: SIMULATION; WARPAGE