Mechanistic insights into the synergistic effect of oxidizers and abrasives in chemical mechanical polishing of 4H-SiC wafer
Release Time:2026-03-29 Hits:
Indexed by: Journal Papers
Document Code: 482095
Date of Publication: 2025-10-18
Journal: CERAMICS INTERNATIONAL
Volume: 51
Issue: 25
Page Number: 43649-43664
ISSN: 0272-8842
Key Words: CMP; COLLOIDAL SILICA; OXIDATION; PERFORMANCE; REMOVAL MECHANISMS; SAPPHIRE; XPS