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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院高性能制造研究所#5015室
联系方式：手机：15104088992
电子邮箱：gaoshang@dlut.edu.cn
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- [41]高尚, 康仁科, 董志刚, 张璧, Wang, Zi-Guang.Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2022,32(2):121-126
- [42]董志刚, 高尚, Huang, Han, 康仁科, Wang, Ziguang.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,83(5-8):1231-1239
- [43]高尚, Huang, Han, 朱祥龙, 康仁科.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
- [44]高尚, 康仁科, 董志刚.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],The Second International Conference on Applied Engineering, Materials and Mechanics (ICAEMM 2017),2022,872:19-24
- [45]康仁科, Zeng, Y.F., 高尚, 董志刚, 郭东明.Surface layer damage of silicon wafers sliced by wire saw process[J],Advanced materials research,2022,797:685-690
- [46]高尚, Huang, Han.Recent advances in micro- and nano-machining technologies[J],机械工程前沿,2022,12(1,SI):18-32
- [47]Liu, H.J., 康仁科, 高尚, 周平, Tong, Y., 郭东明.Development of a measuring equipment for silicon wafer warp[J],Advanced materials research,2022,797:561-565
- [48]高尚, 董志刚, 康仁科, 张璧, 郭东明.Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40:87-93
- [49]Liu, Haijun, 董志刚, 康仁科, 周平, 高尚.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS ...[J],Metrology and Measurement Systems,2022,22(4):531-546
- [50]张玉, 康仁科, 高尚, Huang, Jinxing, 朱祥龙.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grin...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
- [51]杨国林, 董志刚, 高尚, 鲍岩, 康仁科, 郭东明.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2022,253
- [52]高尚, 董志刚, 康仁科, 郭东明.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,227(B4):578-586
- [53]Wu, Y. Q., 高尚, 康仁科, 黄昊.Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2022,54(3):1958-1966
- [54]高尚, Wu, Yueqin, 康仁科, Huang, Han.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,79:165-170
- [55]董志刚, 高尚, 周平, 康仁科, 郭东明.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[J],Advanced materials research,2022,565:105-110
- [56]Liu, Zhiqiang, 康仁科, Haijun, 董志刚, 鲍岩, 高尚, 朱祥龙.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and br...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
- [57]朱祥龙, 于力, 董志刚, 康仁科, 高尚, Li, Liansheng.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206
- [58]高尚, 康仁科, 董志刚, 张璧.Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE,2022,64:31-37
- [59]董志刚, 张倩, Liu, Haijun, 康仁科, 高尚.Effects of taping on grinding quality of silicon wafers in backgrinding[J],FRONTIERS OF MECHANICAL ENGINEERING,2022,16(3):559-569
- [60]高尚, Li, Honggang, 康仁科, 张玉, 董志刚.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],MICROMACHINES,2022,12(1)