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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：机械工程学院高性能制造研究所#5015室
联系方式：手机：15104088992
电子邮箱：gaoshang@dlut.edu.cn
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- [21]高尚, 郎鸿业, 王浩祥, 郭晓光, 康仁科.Atomic understanding of elastic-plastic deformation and crack evolution for single crystal AlN du...[J],Ceramics International,2024
- [22]Wu Zihe, 程吉瑞, 任佳伟, Zhang Yu, 高尚.Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel[A],Journal of Physics: Conference Series,2024,2566(1)
- [23]Yuan Song, 郭晓光, Wang Hao, 高尚.A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond[J],JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,145(7)
- [24]高尚, 李天润, 宋源, Zhang, Yu, 康仁科.Insights into Interfacial Mechanism of CeO(2)/Silicon and Atomic-Scale Removal Process during Che...[J],Langmuir : the ACS journal of surfaces and colloids
- [25]李建贺, 李洪钢, 郭晓光, 康仁科, 高尚.Effect of Wheel Path in Raster Grinding on Surface Accuracy of an Off-Axis Parabolic Mirror[J],APPLIED SCIENCES-BASEL,2024,13(19)
- [26]杨鑫, 任佳伟, 李天润, 康仁科, 高尚.氧化镓单晶的磨削材料去除机理和损伤演化研究[J],湖南大学学报(自然科学版),2024,51(04):10-19
- [27]高尚, 郭晓光, 董志刚, 康仁科.面向专业硕士研究生的硅片加工技术实践教学平台建设[J],时代教育,2024,24:151-153
- [28]董志刚, 程吉瑞, 高尚, 康仁科.潮湿颗粒电解质电化学机械抛光铜工件的接触特性研究[J],航空制造技术,2024,66(13):38-45,72
- [29]高尚, 郭晓光, 董志刚, 康仁科.新工科背景下研究型教学模式探索与实践——以精密加工课程为例[J],教育信息化论坛,2024,01:3-5
- [30]高尚, 杨鑫, 任佳伟, 郭晓光, 康仁科.Abrasive machining induced surface layer damage behavior and formation mechanism of monocrystalli...[J],Materials Characterization,2024,206
- [31]耿大彦, 祁永年, 王崇昆, 郭晓光, 高尚, 康仁科.Computational analysis of electronic structure and optical properties of monocrystalline silicon-...[J],Materials Today Communications,2024,38
- [32]邓曰明, 郭晓光, Wang, Hao, Yuan, Song, 刘巍, 康仁科, 高尚.Atomic understanding of the evolutionary mechanism of fused glass densification generation during...[J],Journal of Materials Research and Technology,2024,28:43-52
- [33]沈煜, 王浩祥, 郭晓光, 高尚.Environment-friendly chemical mechanical polishing using NaHCO3-activated H2O2 slurry for highly ...[J],Journal of Manufacturing Processes,2024,109:213-221
- [34]敖萌灿, 黄金星, Zeng, Yuxian, Wu, Yueqin, 康仁科, 高尚.超精密磨削 YAG 晶体的脆塑转变临界深度预测[J],Optics and Precision Engineering,2024,1:84-94
- [35]高尚, 任佳伟, 李天润, 康仁科, Zhang, Yu.弹性磨抛轮加工硅片面形预测模型及试验验证[J],Surface Technology,2024,53(3):22-27
- [36]朱祥龙, 于力, 董志刚, 康仁科, 高尚.Study into grinding force in back grinding of wafer with outer rim[J],Advances in Manufacturing,2022,8(3):361-368
- [37]高尚, 康仁科, 郭东明, Huang, Q.S..Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel[J],Advanced materials research,2022,126-128:113-118
- [38]康仁科, 高尚, 金洙吉, 郭东明.Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer[A],ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV,2022,416:529-534
- [39]康仁科, 高尚, 金洙吉, 郭东明.Study on grinding performance of soft abrasive wheel for silicon wafer[J],KEY ENGINEERING MATERIALS,2022,416:529-534
- [40]高尚, 康仁科, 朱祥龙, 郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022