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Associate Professor Supervisor of Master's Candidates

Paper Publications

[11]Yin, Zhifu, qiliping, zouhelin, Sun, Lei, Xu, Shenbo.Low auto-fluorescence fabrication methods for plastic nanoslits[J],IET Nanobiotechnology,2022,10(2):75-80
[12]杨正, 王秋森, qiliping, 王兴, like, chenda, chenli, zouhelin.A double layer resist method to improve descum result when removing negative photoresist[J],Micro Nano Letters,2022,14:694-697
[13]Liu, Lingpeng, Sun Lei, qiliping, Guo, Ran, like, Yin, Zhifu, WU Dongjiang, zouhelin.A low-cost fabrication method of nanostructures by ultraviolet proximity exposing lithography[J],AIP Advances,2022,10(4)
[14]Sun Lei, Yin, Zhifu, qiliping, WU Dongjiang, zouhelin.A low-cost method of fabricating hybrid micro-nano fluidic chip by double-layer PDMS mold and U...[J],Microfluidics and Nanofluidics,2022,20(4)
[15]Sun Lei, Liu, Lingpeng, qiliping, Zhou, Jiangang, Yin, Zhifu, WU Dongjiang, zouhelin.A new low-cost fabrication method of SU-8 micro-nano channels and needle tip in electro-hydrody...[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2022,28(11)
[16]Yin, Zhifu, qiliping, zouhelin, Sun, Lei, Xu, Shenbo.A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss a...[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2022,25(8)
[17]qiliping, zouhelin.A novel 2D silicon nano-mold fabricationtechnique by inclined-deposition and Ar etching over 4 in...[J],Scientific Reports,2022,6(1):1892101-1892110
[18]Yin, Zhifu, qiliping, zouhelin, Sun, Lei.A novel 2D silicon nano-mold fabrication technique for linear nanochannels over a 4 inch diamet...[J],Scientific Reports,2022,6:18921
[19]Wang, Xing, Qiusen, qiliping, Shangfei, Fengwei, Ding, Fei, zouhelin.Design and fabrication of composite vibrating plate used for piezoelectric inkjet print head[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2022,29(10)
[20]王兴, 王秋森, qiliping, 王上飞, 王凤伟, 丁飞, zouhelin.Design and fabrication of composite vibrating plate used for piezoelectric inkjet printing head[J],JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2022,29:105003-

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