LaoNGWFtLgJgz51w2LdiwmNDEs0zrgA6C0b9CfIx7wEolugahORKDfdP3fJu
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无铅化电子封装中固/液界面反应研究

Release Time:2016-08-09  Hits:

Leading Scientist: Mingliang Huang

Project Source: 国家自然科学基金项目

Sub-Class of Project: International (Regional) Cooperation and Exchange Project

Status: 结题

Supported by: National Natural Science Foundation of China

Nature of Project: 纵向

Project Approval Number: 50811140338

Date of Project Approval: 2008-07-01

Scheduled Completion Time: 2010-06-30

Date of Project Initiation: 2008-07-01

Date of Project Completion: 2010-06-30

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