Current position: Home >> Scientific Research >> Research Projects

单晶基体界面反应及其对微细无铅焊点可靠性的影响

Hits:

Leading Scientist:Mingliang Huang

Supported by:国家自然科学基金项目

Sub-Class of Project:面上项目

Status:结题

Supported by:国家自然科学基金委员会

Nature of Project:纵向

Project Approval Number:51171036

Date of Project Approval:2011-09-25

Scheduled completion time:2015-12-31

Date of Project Initiation:2012-01-01

Pre One:殷钢与单晶硅高强度连接技术开发

Next One:无铅化电子封装中固/液界面反应研究