Hits:
Indexed by:期刊论文
Date of Publication:2013-01-01
Journal:物理学报
Included Journals:PKU、ISTIC
Volume:62
Issue:8
Page Number:86601-86601
Pre One:Ni-P消耗对焊点电迁移失效机理的影响
Next One:Effects of Temperature and Current Density on (Au, Pd, Ni)Sn-4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints
