On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)
Release Time:2019-03-12 Hits:
Indexed by: Journal Article
Date of Publication: 2018-11-01
Journal: MATERIALS LETTERS
Included Journals: SCIE
Volume: 230
Page Number: 76-76
ISSN: 0167-577X