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On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)

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Indexed by:期刊论文

Date of Publication:2018-11-01

Journal:MATERIALS LETTERS

Included Journals:SCIE

Volume:230

Page Number:76-76

ISSN No.:0167-577X

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