Hits:
Indexed by:Journal Papers
Date of Publication:2019-01-01
Journal:Journal Materials Science
Included Journals:SCIE
Volume:54
Page Number:7975-7986
Pre One:Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy
Next One:On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)