xJ6KOWP1DCcSWENOxu7Y9tePM72xmHijNd0FaPj9v9p43KAKtXDZHZeQfn3x
Current position: Home >> Scientific Research >> Paper Publications

Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy

Release Time:2019-03-14  Hits:

Indexed by:Journal Article

Date of Publication:2002-11-01

Journal:MATERIALS LETTERS

Included Journals:EI、SCIE、Scopus

Volume:56

Issue:6

Page Number:1039-1042

ISSN:0167-577X

Key Words:lead-free solder; rare earth elements; wettability; tensile property

Summary:The influence of mixture (La, Ce) rare earth elements (RE) on wettability and tensile property in Sn-3.5Ag solder alloy was investigated. The wetting property was improved by 0.25-0.5% addition of (La, Cc) rare earth elements into the Sn-3.5Ag solder alloy, while over addition of the rare earth elements up to 1.0 wt.% reduced the beneficial influence. The ultimate strength and ductility were also enhanced by 0.25-0.5% addition of (La, Ce) rare earth elements, while the change of melting temperature was negligible. (C) 2002 Elsevier Science B.V. All rights reserved.

Prev One:Creep behavior of eutectic Sn-Ag lead-free solder alloy

Next One:Creep Behavior of eutectic Sn-Cu lead-free solder alloy (vol 31, pg 442, 2002)