Release Time:2019-03-14  Hits:

Indexed by: Journal Article

Date of Publication: 2002-07-01

Journal: JOURNAL OF ELECTRONIC MATERIALS

Included Journals: SCIE

Volume: 31

Issue: 7

Page Number: 828-828

ISSN: 0361-5235

Key Words: creep; eutectic Sn-Cu; lead-free solder alloy; precipitation strengthening; activation energy