Creep Behavior of eutectic Sn-Cu lead-free solder alloy (vol 31, pg 442, 2002)
Release Time:2019-03-14 Hits:
Indexed by:Journal Article
Date of Publication:2002-07-01
Journal:JOURNAL OF ELECTRONIC MATERIALS
Included Journals:SCIE
Volume:31
Issue:7
Page Number:828-828
ISSN:0361-5235
Key Words:creep; eutectic Sn-Cu; lead-free solder alloy; precipitation strengthening; activation energy