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Creep Behavior of eutectic Sn-Cu lead-free solder alloy (vol 31, pg 442, 2002)

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Indexed by:期刊论文

Date of Publication:2002-07-01

Journal:JOURNAL OF ELECTRONIC MATERIALS

Included Journals:SCIE

Volume:31

Issue:7

Page Number:828-828

ISSN No.:0361-5235

Key Words:creep; eutectic Sn-Cu; lead-free solder alloy; precipitation strengthening; activation energy

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