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Indexed by:期刊论文

Date of Publication:2015-04-01

Journal:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Included Journals:SCIE、EI、Scopus

Volume:26

Issue:4

Page Number:2278-2285

ISSN No.:0957-4522

Abstract:The tensile properties of Cu/Sn-9Zn/Cu solder interconnects with solder sizes of 200 and 300 mu m in three dimensions after aging and electromigration (EM) were investigated. The tensile strength decreased with increasing aging/EM time. During aging, the tensile strength was mainly determined by the strength of the solder and the fracture site tended to shift from the interface to the solder with increasing time. During EM, the tensile strength was mainly determined by the bonding strength of the interface and the fracture site tended to shift from the solder to the cathode interface with increasing time. Both tensile strength and fracture site were strongly related to the residual Zn content in the solder. The larger solder interconnects had a higher tensile strength due to a higher residual Zn content. The effect of solder size on failure mode of the Cu/Sn-9Zn/Cu solder interconnects after aging and EM was discussed.