Current position: Home >> Scientific Research >> Research Projects

GaN器件芯片材料导热性能测试

Release Time:2024-01-09  Hits:

Leading Scientist: 张晓亮

Project Source: 企事业单位委托科技项目

Status: 结题

Supported by: China Electronics Technology Group Corporation No. 13 Research Institute

Nature of Project: 横向

Date of Project Approval: 2022-10-11

Scheduled Completion Time: 2022-10-30

Date of Project Initiation: 2022-09-10

Date of Project Completion: 2023-07-14

Next One:基于热膨胀效应的异质结构热整流器热输运特性研究