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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：女
毕业院校：东北大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 微机电工程. 机械电子工程
办公地点：西部校区机械学院新大楼6009房间
电子邮箱：duliqun@dlut.edu.cn
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- [181]闫卫平, 席文柱, 邝永变, 杜立群.Ni薄膜热敏电阻的研究[J],仪器仪表学报,2004,25(z1):308-309
- [182]闫卫平, 席文柱, 邝永变, 杜立群.Ni薄膜热敏电阻的研究[A],2004,308-309
- [183]刘大震, 杜立群, 闫卫平, 郭吉洪.PCR生物芯片微反应腔的制作及其热分析[A],2003,321-323,327
- [184]席文柱, 闫卫平, 杜立群, 郭吉洪.硅基PCR生物芯片微型加热器及温度传感器的研究[A],2003,332-334,337
- [185]席文柱, 郭吉洪, 闫卫平, 杜立群.硅基PCR生物芯片微型加热器及温度传感器的研究[J],微纳电子技术,2003,40(7):332-334,337
- [186]Du Liqun, Hao Yongping, Liu Shuangjie, Yang Tong, Zhao Ming, Luo Lei, Tao Yousheng, Chen Shengli.Stress reduction method in fabrication of a multi-scale inertial switch with ultra-high aspect ra...[J],Microsystem Technologies,2017,23(6):1867-1877
- [187]杜立群, 宋磊, 刘文涛, 喻立川.金属基底上三维可动微机构的制作,纳米技术与精密工程,2009,7(1):36-40
- [188]杜立群, 陈胜利, 陶友胜, 罗磊, 赵明, 刘双杰.跨尺度、高深宽比惯性微开关制作工艺研究,电加工与模具,2016,4:26-29
- [189]Chang Song, Weitai Wang, Wen Zhao, Heqing Zhu, Wenjun Zhao, Liqun Du, Liqun Du.Effectiveness of stress release geometries on reducing residual stress in electroforming metal mi...,Journal of Micromechanics and Microengineering,2018,28(4)
- [190]Zhang Xiaolei, Xu Zheng, Du Liqun, Du Liqun.The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecul...,Journal of Applied Polymer Science,2019,127(6):4456-4462
- [191]Liqun Du, Mancang Song, Hongling Chang.A method of water pretreatment to improve the thermal bonding rate of PMMA microfluidic chip,Microsystem Technologies,2012,18(4):423-428
- [192]杜立群, 王翱岸, 赵明, 鲍其雷.在金属基底上制作高深宽比金属微光栅的方法,光学精密工程,2015,23(3):700-707
- [193]Zhao Zhong, Luo Lei, Li Qingfeng, Tao Yousheng, Du Liqun, Du Liqun.Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and ...[J],Ultrasonics Sonochemistry,2019,33:10-17
- [194]Xi Zhanwen, Zhang Ping, Nie Weirong, Du Liqun, Cao Yun.A novel MEMS omnidirectional inertial switch with flexible electrodes,Sensors and Actuators A: Physical,2014,212:93-101
- [195]Song Chang, Li Yuanqi, Li Xiaojun, Li Yu, Qi Leijie, Du Liqun, Du Liqun.Residual stress measurement in a metal microdevice by micro Raman spectroscopy,Journal of Micromechanics and Microengineering,2017,27(10)
- [196]Du Liqun, Wang QJ, Du LQ.Experimental study on ultrasonic stress relief for cured SU-8 photoresist layer,Microelectronic Engineering,2010,87(12):2555–2560
- [197]Du Liqun, Wang Qijia, Zhang xiaolei.Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment,SCIENCE CHINA - TECHNOLOGICAL SCIENCES,2010,55(11):3006-3013
- [198]Zhang Xiaolei, Zhao Ming, Du Liqun, Du Liqun.Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Subst...,JOURNAL OF APPLIED POLYMER SCIENCE,2014,133(24):411081-411089
- [199]杜立群.Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro ele...[J],Journal of Micromechanics and Microengineering,2018,28(7):075017
- [200]Zhao Zhong, Shao Ligeng, Xu Zheng, Du Liqun, Du Liqun.Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu subst...[J],Ultrasonics Sonochemistry,2019,29:1-10