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基 于 磨 粒 三 维 轨 迹 的 钽 酸 锂 双 面 研 磨 均 匀 性

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Date of Publication:2024-09-30

Journal:Optics and Precision Engineering

Volume:32

Issue:13

Page Number:2081-2090

ISSN No.:1004-924X

Key Words:Abrasive cutting; Abrasive particles; Crystal cutting; Double sided; Fixed abrasive lapping; Fixed abrasives; Gear cutting; Lapping machines; LiTaO 3; Lithium tantalate; Material removal; Material removal planarization; Micromachining; Particle trajectories; Planarization; Single crystals; Tantalate minerals

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