高端芯片用半导体基片原子级磨削技术的研究现状与发展趋势
Release Time:2026-03-29 Hits:
Indexed by: Journal Papers
Document Code: 592703
Date of Publication: 2025-01-01
Journal: China Surface Engineering
Volume: 38
Issue: 5
Page Number: 60-82
ISSN: 1007-9289
Key Words: atomic-level grinding; machining process; mechanism; semiconductor substrate