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Prediction model for surface shape of YAG wafers in wafer rotational grinding

Release Time:2026-03-29  Hits:

Indexed by: Journal Papers

Document Code: 478696

Date of Publication: 2025-02-01

Journal: INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Volume: 287

ISSN: 0020-7403

Key Words: BRITTLE TRANSITION; CHIP THICKNESS; CUTTING DEPTH; ELASTIC RECOVERY; FORCE; HARDNESS; MATHEMATICAL-MODEL; SILICON-WAFERS; SIZE; THIN-DISK

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