Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding
Release Time:2026-03-29 Hits:
Indexed by: Journal Papers
Document Code: 478461
Date of Publication: 2025-06-01
Journal: INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING
Volume: 7
Issue: 3
ISSN: 2631-8644
Key Words: BRITTLE MATERIALS; CERAMICS; CHIP THICKNESS; ELASTIC-MODULUS; FORCE; HARDNESS; PLASTIC INDENTATION DAMAGE; SILICON-WAFER