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Paper Publications

[111]Li, Shuang, Du, Yao, Qu, Lin, Kunwar, Anil, Sun, Junhao, Liu, Jiahui, Zhao, Ning, Huang, Mingliang, Ma, Haitao.The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows[A],2014,937-939
[112]Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaohua, Wang, Jingyun.Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects[A],2014,429-432
[113]Huang, Mingliang, Feng, Xiaofei, Zhao, Ning, Zhang, Zhijie.Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Tempera...[A],2014,433-436
[114]Huang, M. L., Yang, F., Zhao, N., Y. C., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2014,602:281-284
[115]Qu, Lin, Zhao, Ning, Ma, Haitao, Huijing, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-soli...[J],JOURNAL OF APPLIED PHYSICS,2014,115(20)
[116]Huang, M. L., Kang, N., Yang, Y. C., Hou, X. L., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Microstructure and interfacial reaction of Sn-Zn-x(Al,Ag) near-eutectic solders on Al and Cu su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(5):2311-2319
[117]Qu, L., Zhao, N., H. J., Huang, M. L., Ma, H. T., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the sold...[J],SCRIPTA MATERIALIA,2014,72-73:43-46
[118]Huang, M. L., Zhou, Q., Zhao, N., Liu, X. Y., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid...[J],JOURNAL OF MATERIALS SCIENCE,2014,49(4):1755-1763
[119]黄明亮.Electromigration Reliability of Lead-free Solder Interconnects[J],ECS Transactions,2014,60(1):811-816
[120]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai, XY (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(1):328-337

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