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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[121]Huang M.L..Electromigration reliability of lead-free solder interconnects[A],2014,60(1):811-816
[122]黄明亮.Different diffusion behavior of Cu、Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects under L-S elect...[A],2014
[123]黄明亮, 赵宁.Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in...[J],Journal of Alloys and Compounds,2014,602(1):281-284
[124]Huang, M. L., Zhou, Q., Zhao, N., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electr...[J],JOURNAL OF ELECTRONIC MATERIALS,2013,42(10):2975-2982
[125]Zhao, N., Liu, X. Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(10):3925-3931
[126]Huang, Mingliang, Liu, Ting, Zhao, Ning, Hao, Hua.Interfacial Reaction in Cu/Sn/Cu Fine Pitch Interconnect during Soldering[A],2013,382-+
[127]Chen L., Feng Y., Liu X., Huang M..Effects of temperature and current density on (Au, Pd, Ni)Sn4 redistribution and Ni-P consumption...[A],2013,1064-1069
[128]Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Feng, Xiaofei.Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation...[A],2013,126-129
[129]Qu, Lin, Ma, Haitao, Zhao, Huijing, Ning, Kunwar, Anil, Huang, Mingliang.The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5[A],2013,377-381
[130]An, Lili, Ma, Haitao, Qu, Lin, Wang, Jie, Liu, Jiahui, Huang, Mingliang.The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction[A],2013,264-267

total238 13/24

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