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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[101]黄明亮.Applications of synchrotron radiation real-time imaging technology in characterizing the reliabil...[A],2015
[102]黄明亮, 赵宁.Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bu...[J],Acta Materialia,2015,100(11):98-106
[103]Huang, M. L., Zhang, Z. J., Ma, H. T., Chen, L. D., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2014,30(12):1235-1242
[104]Huang, M. L., Yang, F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substra...[J],SCIENTIFIC REPORTS,2014,4:7117
[105]Huang, Mingliang, Zhang, Zhijie, Zhou, Shaoming, Chen, Leida, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing elec...[J],JOURNAL OF MATERIALS RESEARCH,2014,29(21):2556-2564
[106]Huang, M. L., F. F., Pan, J. L., Zhang, T. X., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Composition control of co-electroplating Au-Sn deposits using experimental strategies[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(11):4933-4942
[107]Zhao, N., Huang, M. L., Ma, H. T., Yang, F., Zhang, Z. J., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Influence of Rare Earth Ce Addition on the Microstructure, Properties and Soldering Reaction of...[J],METALS AND MATERIALS INTERNATIONAL,2014,20(5):953-958
[108]黄明亮, 赵宁.电子封装技术[J],国际学术动态,2014,04:39-41
[109]Zhou, Q., Y., Qin, X., Wang, X. J., Huang, M. L..Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during Liquid...[A],2014,1164-1168
[110]Huang, Mingliang, Zhang, Fei, Yang, Fan, Zhao, Ning.Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects[A],2014,1190-1193

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