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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[91]黄明亮, 冯晓飞, 赵建飞, 张志杰, Huang, Ming-Liang.Cu/Sn-58Bi/Ni焊点液-固电迁移下Cu和Ni的交互作用[J],中国有色金属学报,2015,25(4):967-974
[92]Huang, M. L., Zhang, F., Yang, Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Size effect on tensile properties of Cu/Sn-9Zn/Cu solder interconnects under aging and current ...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(4):2278-2285
[93]Huang, M. L., Yang, F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting React...[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2015,31(3):252-256
[94]Huang, M. L., Yang, F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(2):933-942
[95]Huang, M. L., Yang, F., Zhao, N., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction[J],MATERIALS LETTERS,2015,139:42-45
[96]Huang, M. L., Zhang, Z. J., Zhao, N., Yang, F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..In situ study on reverse polarity effect in Cu/Sn-9Zn/Ni interconnect undergoing liquid-solid e...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2015,619:667-675
[97]黄明亮, 张志杰, 冯晓飞, 赵宁, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..液-固电迁移Ni/Sn-9Zn/Ni焊点反极性效应研究[J],金属学报,2015,51(01):93-99
[98]Qu, Lin, Zhao, Ning, Ma, Haitao, Huijing, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Solde...[J],JOURNAL OF ELECTRONIC MATERIALS,2015,44(1):467-474
[99]Zhao, N., Huang, M. L., Zhong, Y., Ma, H. T., Pan, X. M., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions ...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(1):345-352
[100]赵宁, 黄明亮, 马海涛.热迁移对Cu/Sn/Cu焊点液-固界面Cu6Sn5生长动力学的影响[J],物理学报,2015,64(16):166601-166601

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