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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[81]Huang, M. L., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA ...[J],JOURNAL OF ELECTRONIC MATERIALS,2015,44(10):3927-3933
[82]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interco...[J],SCIENTIFIC REPORTS,2015,5:13491
[83]赵宁, 马海涛, 黄明亮, 钟毅, Zhao, Ning.微焊点中金属原子的热迁移及其对界面反应影响的研究进展[J],中国有色金属学报,2015,25(8):2157-2166
[84]Zhong, Yi, Ma, Haitao, Zhao, Ning, Huang, Mingliang.Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint[A],2015,1271-1274
[85]Zhao, Ning, Huang, Mingliang, Ma, Haitao, Zhong, Yi.Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient[A],2015,1263-1266
[86]Zhao, Jianfei, Huang, Mingliang, Ning, Zhang, Zhijie.Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electro...[A],2015,1275-1278
[87]Xu, Liwei, Huang, Mingliang, Yao, Quanbin, Wang, Yong, Lian, Binhao.Effect of Cu on Interfacial Reaction in High-lead Solder Bumps[A],2015,1279-1282
[88]Liu, Yawei, Huang, Mingliang, Feifei, Zhao, Ning.Effects of Stirring Speed on Composition and Morphology of Non-cyanide Co-electroplating Au-Sn ...[A],2015,1283-1286
[89]Liu, Jiaxi, Zhao, Ning, Zhang, Liwen, Huang, Mingliang.Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints[A],2015,1267-1270
[90]赵宁, 钟毅, 黄明亮, 马海涛, 刘小平, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..热迁移对Cu/Sn/Cu焊点液-固界面Cu_6Sn_5生长动力学的影响[J],物理学报,2015,64(16):348-357

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