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Mingliang Huang
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[71]赵宁, 黄明亮, 马海涛.Interfacial reactions of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,1(1):273-276
[72]黄明亮, 吴爱民.Study on the electronmigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls[A],2016,1(1):524-527
[73]Qiu, Yan, Huang, Mingliang, Wu, Aimin.Study on the electromigration-induced failure mechanism of Sn-3.0 Ag-0.5Cu BGA solder balls[A],2016,524-527
[74]黄明亮, 赵宁.Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechanism...[J],Journal of Alloys and Compounds,2016,678(1):370-374
[75]马海涛, 赵宁, 黄明亮.On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solde...[J],Materials Letters,2016,172(1):211-215
[76]黄明亮, 赵宁.Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates[A],2016,1(1):534-537
[77]马海涛, 赵宁, 黄明亮, 王云鹏.Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder join...[J],Journal of Material Science: Materials in Electronics,2016,28(1):5398-5406
[78]黄明亮.Dominant effect of diffusion anisotropy in β-Sn grain on electromigration behavior of SnAgCu sol...[A],2016,1(1):1-2
[79]Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Yang, Fan, ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Liaoning, Peoples R China..Migration behavior of indium atoms in Cu/Sn-52In/Cu interconnects during electromigration[J],JOURNAL OF MATERIALS RESEARCH,2015,30(21):3316-3323
[80]Huang, M. L., Zhao, J. F., Zhang, Z. J., N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chi...[J],ACTA MATERIALIA,2015,100:98-106
total238 8/24
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