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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[61]Qiu Y., Huang M., Wu A..Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls[A],2016,524-527
[62]Zhao, N., Huang, M. L., Wu, C. M. L., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Tensile creep behavior of Sn-Ag-Cu-Ni multicomponent lead-free solder alloy[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(7):6630-6636
[63]Kunwar, Anil, Ma, Haoran, Haitao, Guo, Bingfeng, Meng, Zhixian, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromi...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(7):7699-7706
[64]Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2016,172:211-215
[65]黄明亮, 赵宁, 刘爽, 何宜谦, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu 焊点跌落失效模式[J],中国有色金属学报（英文版）,2016,26(6):1663-1669
[66]Huang, M. L., Zhang, Z. J., Yang, F., Zhao, N..Novel growth of whole preferred orientation intermetallic compound interconnects for 3D IC pack...[A],2016,2016-August:1216-1221
[67]Huang, M. L., Yang, Y. C., Chen, Y., Dong, C., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-g...[J],MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2016,664:221-226
[68]Zhong, Yi, Dong, Wei, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao, N (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
[69]Zhong, Yi, Huang, Mingliang, Deng, Jianfeng, Ma, Haitao, Dong, Wei, Zhao, Ning.STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION[A],2016
[70]Huang, M. L., Yang, F., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/C...[J],MATERIALS & DESIGN,2016,89:116-120

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