Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] Zhao, N..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Dong, W.,Zhong, Y.,Huang, M. L.,Ma, H. T..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient[J],INTERMETALLICS,2016,79:28-34
- [2] Zhao, N..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ma, H. T.,Wang, Y. P.,Zhong, Y.,Huang, M. L.,Dong, W..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
- [3] Huang, M. L..Huang, ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Zhao, J. F.,Zhang, Z. J.,Zhao, N..Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,678:370-374
- [4] Zhao, Ning.Ma, Haitao,Dong, Wei,Zhong, Yi,Huang, Mingliang.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient[A],2016:264-267
- [5] Chen, Y..Zhao, N.,Huang, M. L..Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates[A],2016:534-537
- [6] Huang, Feifei.Liu, Yawei,Huang, Mingliang.Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applications[A],2016:538-541
- [7] Zhao, Ning.Ma, Haitao,Deng, Jianfeng,Zhong, Yi,Huang, Mingliang.Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016:273-276
- [8] Zhou, Q..Zhou, Y.,Wang, X. J.,Huang, M. L.,Li, Q..Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects[A],2016:473-476
- [9] Fan, M..Huang, M. L.,Zhao, N..Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects[A],2016:542-545
- [10] Tang, Fangwu.Huang, Mingliang,Huang, Feifei.Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging[A],2016:301-303