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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[51]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects...[J],INTERMETALLICS,2016,79:28-34
[52]Zhao, N., Zhong, Y., Huang, M. L., Dong, W., Ma, H. T., Wang, Y. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
[53]Huang, M. L., Zhao, J. F., Zhang, Z. J., N., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechani...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,678:370-374
[54]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under t...[A],2016,264-267
[55]Chen, Y., Huang, M. L., Zhao, N..Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates[A],2016,534-537
[56]Huang, Feifei, Liu, Yawei, Mingliang.Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applica...[A],2016,538-541
[57]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Huang, Mingliang, Ma, Haitao.Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,273-276
[58]Zhou, Q., Li, Y., Wang, X. J., Huang, M. L..Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnec...[A],2016,473-476
[59]Fan, M., Huang, M. L., Zhao, N..Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects[A],2016,542-545
[60]Tang, Fangwu, Huang, Mingliang, Feifei.Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging[A],2016,301-303

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