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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[41]Zhao, N., Deng, J. F., Zhong, Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Unde...[J],JOURNAL OF ELECTRONIC MATERIALS,2017,46(4):1931-1936
[42]Zhao, N., Zhong, Y., Dong, W., Huang, M. L., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Wong, CP (reprint author), Georgia Inst Technol, Atlanta, GA 30332 USA..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
[43]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., N, Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
[44]Kuang, Jiameng, Yang, Fan, Huang, Mingliang.Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects[A],2017,1286-1290
[45]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., Wong, C. P..Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applicat...[A],2017,0:411-416
[46]黄明亮.Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J],Acta Metallurgica Sinica,2017,53(9):592-600
[47]Huang, M. L., F. F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Study on Co-Electrodeposition Mechanism of Au-30at.%Sn Eutectic in Non-Cyanide Bath by Electroc...[J],JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2017,164(7):D445-D450
[48]Sun, Hongyu, Huang, Mingliang.Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0...[A],2017,1296-1299
[49]赵宁, 董伟, 黄明亮, 马海涛.Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interc...[J],Applied Physics Letters,2017,110(9):93504-
[50]Liu, XingBo, Huang, Mingliang.Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipit...[A],2017,1291-1295

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