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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[31]Huang, F. F., M. L., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Complexation Behavior and Co-Electrodeposition Mechanism of Au-Sn Alloy in Highly Stable Non-Cy...[J],JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2018,165(3):D152-D159
[32]Lv, Qipeng, Huang, Mingliang, Deng, Songwen, Li, Gang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Li, G (reprint author), Chinese Acad Sci, Dalian Inst Chem Phys, Key Lab Chem Lasers, Dalian 116023.Fabrication of broadband antireflection coatings using wavelength-indirect broadband optical mo...[J],OPTIK,2018,156:325-332
[33]Zhang, Shuye, Lin, Tiesong, Zhao, Ning, Huang, Mingliang, Paik, Kyung-Wook, He, Peng, KW (reprint author), Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Daejeon 34141, South Korea..A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2017,7(12):2087-2094
[34]Sun, Hongyu, Huang, Mingliang.Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag...[A],2017,1296-1299
[35]Sun, H., Huang, M..Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag...[A],18th International Conference on Electronic Packaging Technology, ICEPT 2017,2017,1296-1299
[36]Huang, M. L., Yang, Y. C., F. F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Composition design of Sn-rich Sn-Au-Ag solders using cluster-plus-glue-atom model[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(15):11192-11201
[37]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, Chingping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
[38]Zhang, Zhijie, Huang, Mingliang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Cu/Sn-52In/Cu微焊点液-固电迁移行为研究[J],金属学报,2017,53(05):592-600
[39]Zhang, Z. J., Huang, M. L., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Comment on "Electric current induced flow of liquid metals: Mechanism and substrate-surface eff...[J],JOURNAL OF APPLIED PHYSICS,2017,121(13)
[40]Guo, Bingfeng, Huang, Mingliang, Zhao, Ning, Kunwar, Anil, Wang, Yunpeng, Jiang, Chengrong, Ma, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder jo...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406

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